I have a problem with an IGEPv2 board. After having the board continously playing for about a week (With short intervals for software changes in between), when trying to extract the audio jack from the audio output of the board, the female jack went with the male one. I did not force the connector; it was like it has lost the glue that kept the pad in his place. In fact, pads are unbent.
So, first question: May this be because of the heat produced by the board? I mean, is this a consequence of having no heat sinks?
By the way, we wanted to try components video also, so we are using this board to try it. We will try also to repair this, so have been searching for the best points to solder back de signal pins. For the ground one there is no problem. For the signal that has a track in the top face there is not problem, also. Scrapping a little the track allows a thin wire to be soldered. Problem comes with the signal that enters the pad by a via. Since we prefer not to touch the via itself, we think the best place to solder is the capacitor in the bottom face:
Any thoughts on this?
Thanks in advance.